Electronics Manufacturing worked example
Solder Paste Usage at 59% paste usage efficiency: a worked example
This worked example runs the solder paste usage numbers for a tougher week than the baseline: 59% paste usage efficiency instead of the typical 82%. Estimate solder paste required for an SMT build from boards or panels, paste per board, and print-transfer efficiency.
The inputs for this scenario
- Boards or panels to print: 1,800 boards or panels (held at the documented default)
- Solder paste per board or panel: 0.42 g / item (held at the documented default)
- Paste usage efficiency: 59 % (the input this scenario stresses; the baseline uses 82)
Working through the calculation
- The calculation starts from the formula this tool documents: Theoretical paste deposited = boards or panels to print × solder paste per board or panel.
- Required solder paste works out to 1,281 g at these inputs, and this is the headline figure for the scenario.
- Theoretical paste deposited works out to 756 g at these inputs.
- Paste waste allowance works out to 525 g at these inputs.
- Paste usage efficiency works out to 59 % at these inputs.
How this compares with the baseline
- Against the tool's baseline example, where paste usage efficiency sits at 82% and the headline result is 922 g, this scenario comes in 38.98% above the baseline at 1,281 g.
- Use it when ordering paste for a known build quantity, sizing a kanban bin at the printer, or comparing paste consumption across product lines. A result at this level usually justifies acting on the stressed input before touching anything else, because every other figure in the table is downstream of it.
Results at a glance
- Required solder paste: 1,281 g (headline result)
- Theoretical paste deposited: 756 g
- Paste waste allowance: 525 g
- Paste usage efficiency: 59 %
Run it with your numbers
- To rerun this with your own numbers, open the live Solder Paste Usage calculator, set paste usage efficiency to your actual value, and adjust the remaining inputs to match your operation.
Last reviewed 2026-05-12.