Adhesives, Sealants & Industrial Bonding worked example

Bonding Process Risk Score with bond failure severity of 20 1-10: a worked example

Push bond failure severity up to 20 1-10 and the picture changes. This example computes every intermediate figure at that operating point. a quality manager needs to prioritize bonding process controls for a new or unstable adhesive operation

The inputs for this scenario

  • Bond failure severity: 20 1-10 (raised for this scenario; the documented default is 8)
  • Bond defect occurrence: 5 1-10 (unchanged)
  • Detection weakness: 6 1-10 (unchanged)

Working through the calculation

  • Applying the documented formula (Bonding process risk score = severity score × occurrence score × detection score) to the inputs above produces each figure below.
  • At this operating point the engine returns 11.25 score for bonding process risk score, the number this scenario is built around.
  • At this operating point the engine returns 20 1-10 for bond failure severity.
  • At this operating point the engine returns 5 1-10 for bond defect occurrence.
  • At this operating point the engine returns 6 1-10 for detection weakness.

How this compares with the baseline

  • Against the tool's baseline example, where bond failure severity sits at 8 1-10 and the headline result is 6.45 score, this scenario comes in 74.42% above the baseline at 11.25 score.
  • It computes a risk priority number by multiplying bond failure severity, defect occurrence, and detection weakness ratings together. The value of this scenario is the size of the gap it exposes: that gap, priced out over a year, is the budget you can justify spending to close it.

Results at a glance

  • Bonding process risk score: 11.25 score (headline result)
  • Bond failure severity: 20 1-10
  • Bond defect occurrence: 5 1-10
  • Detection weakness: 6 1-10

Run it with your numbers

  • Every input above is editable in the live Bonding Process Risk Score calculator, which recalculates instantly and can be shared with the inputs intact.

Last reviewed 2026-05-12.