Electronics Manufacturing worked example
Wafer Die Yield at 99% target die yield: a worked example
What does the result look like when target die yield reaches 99%? The full calculation is worked below with real intermediate numbers. a semiconductor process or yield engineer is reviewing wafer probe performance
The inputs for this scenario
- Passing die at wafer probe: 48,200 die (unchanged)
- Total die tested: 52,000 die (unchanged)
- Target die yield: 99 % (raised for this scenario; the documented default is 94)
Working through the calculation
- Applying the documented formula (Wafer die yield = passing die at wafer probe ÷ total die tested) to the inputs above produces each figure below.
- At this operating point the engine returns 92.69 % yield for wafer die yield, the number this scenario is built around.
- At this operating point the engine returns 6.31 points for die yield gap to target.
- At this operating point the engine returns 48,200 die for passing die.
- At this operating point the engine returns 52,000 die for total die tested.
How this compares with the baseline
- Against the tool's baseline example, where target die yield sits at 94% and the headline result is 92.69 % yield, this scenario lands almost exactly on the baseline at 92.69 % yield.
- A figure at this level is achievable when target die yield is genuinely sustained, not just peaked for a shift. Raw die yield does not separate random defect loss from systematic or edge-of-wafer loss, so a single percentage can hide a fixable spatial signature — pair it with a wafer map.
Results at a glance
- Wafer die yield: 92.69 % yield (headline result)
- Die yield gap to target: 6.31 points
- Passing die: 48,200 die
- Total die tested: 52,000 die
Run it with your numbers
- Every input above is editable in the live Wafer Die Yield calculator, which recalculates instantly and can be shared with the inputs intact.
Last reviewed 2026-05-12.