How do you calculate wafer die yield?

Divide passing die at wafer probe by total die tested. With 48,200 passing die out of 52,000 tested, die yield is 48,200 ÷ 52,000 = 92.69%.

What is a good wafer die yield?

It depends on die size, node, and product maturity — mature, small-die products can exceed 95%, while large or new die run lower. The example's 92.69% sits about 1.3 points under a 94% target, a tight but real gap.

What is the difference between die yield and wafer yield?

Die yield is the passing-die fraction within wafers; wafer yield is the fraction of wafers that survive the line at all. Multiply them with assembly and final-test yield to get the overall line yield for cost-per-die.

Why is my edge die yield lower than center yield?

Edge die suffer from film non-uniformity, lithography focus roll-off, and handling damage, producing a ring of failures. A flat die-yield number hides this — only a wafer map reveals the systematic edge signature behind the loss.

How does defect density relate to die yield?

Yield models like the Murphy or Poisson model predict die yield from defect density and die area; larger die catch more defects and yield lower at the same density. Measured die yield below the model points to systematic, not random, loss.

How many die does a 1.3-point yield gap represent?

At 52,000 die tested, 1.3 points is roughly 680 additional good die per wafer lot of that size — at leading-node die values, recovering them can be substantial revenue per lot.

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Wafer Die Yield Calculator

Wafer die yield is the percentage of die on a wafer that pass electrical test at wafer probe (sort), before packaging. Process and yield engineers in semiconductor fabs live by this number because it directly sets the cost per good die — every failing die still consumed the same silicon, masks, and process time as a passing one. It is the bridge between defect density on the wafer and the saleable output of a lot. Because packaging and final test only operate on die that already passed probe, die yield caps the economics of everything downstream.

What this calculator does

Measure good-die yield from passing die count, total die tested, and target die yield.
a semiconductor process or yield engineer is reviewing wafer probe performance
It computes the fraction of probed die that pass electrical sort, plus the gap in points to your target die yield.

Formula used

Wafer die yield = passing die at wafer probe ÷ total die tested
Die yield gap to target = target die yield - wafer die yield

Inputs explained

Passing die at wafer probe: Use a current, same-scope value for passing die at wafer probe from the traveler, MES, ERP, test log, quote, or validated engineering estimate.
Total die tested: Use a current, same-scope value for total die tested from the traveler, MES, ERP, test log, quote, or validated engineering estimate.
Target die yield: Use a current, same-scope value for target die yield from the traveler, MES, ERP, test log, quote, or validated engineering estimate.

How to use the result

Use it per wafer, per lot, or per product to track sort performance, compare to a yield model, and quantify the recovery needed to hit target.
Raw die yield does not separate random defect loss from systematic or edge-of-wafer loss, so a single percentage can hide a fixable spatial signature — pair it with a wafer map.

Current U.S. benchmarks

The producer price index for copper and brass mill shapes stands at 559.593 (BLS, May 2026), up 76.8% from a year earlier. Quotes priced off last quarter's material cost miss this move. Global copper trades at $13,484 per tonne (IMF via FRED, May 2026).
The U.S. has 11,261 computer and electronic products establishments employing about 815,443 workers (Census County Business Patterns, 2023).

Common questions

How do you calculate wafer die yield? Divide passing die at wafer probe by total die tested. With 48,200 passing die out of 52,000 tested, die yield is 48,200 ÷ 52,000 = 92.69%.
What is a good wafer die yield? It depends on die size, node, and product maturity — mature, small-die products can exceed 95%, while large or new die run lower. The example's 92.69% sits about 1.3 points under a 94% target, a tight but real gap.
What is the difference between die yield and wafer yield? Die yield is the passing-die fraction within wafers; wafer yield is the fraction of wafers that survive the line at all. Multiply them with assembly and final-test yield to get the overall line yield for cost-per-die.
Why is my edge die yield lower than center yield? Edge die suffer from film non-uniformity, lithography focus roll-off, and handling damage, producing a ring of failures. A flat die-yield number hides this — only a wafer map reveals the systematic edge signature behind the loss.
How does defect density relate to die yield? Yield models like the Murphy or Poisson model predict die yield from defect density and die area; larger die catch more defects and yield lower at the same density. Measured die yield below the model points to systematic, not random, loss.

Last reviewed 2026-05-12.