Electronics Manufacturing worked example

Wafer Die Yield at 68% target die yield: a worked example

Suppose target die yield falls to 68%. This page works the full calculation at that level so you can see exactly which result moves and by how much. Measure good-die yield from passing die count, total die tested, and target die yield.

The inputs for this scenario

  • Passing die at wafer probe: 48,200 die (held at the documented default)
  • Total die tested: 52,000 die (held at the documented default)
  • Target die yield: 68 % (the input this scenario stresses; the baseline uses 94)

Working through the calculation

  • The calculation starts from the formula this tool documents: Wafer die yield = passing die at wafer probe รท total die tested.
  • Wafer die yield works out to 92.69 % yield at these inputs, and this is the headline figure for the scenario.
  • Die yield gap to target works out to -24.69 points at these inputs.
  • Passing die works out to 48,200 die at these inputs.
  • Total die tested works out to 52,000 die at these inputs.

How this compares with the baseline

  • Against the tool's baseline example, where target die yield sits at 94% and the headline result is 92.69 % yield, this scenario lands almost exactly on the baseline at 92.69 % yield.
  • It computes the fraction of probed die that pass electrical sort, plus the gap in points to your target die yield. When the numbers land here, the stressed input is the lever to work; the walkthrough above shows exactly how much each output recovers as it climbs back toward the baseline.

Results at a glance

  • Wafer die yield: 92.69 % yield (headline result)
  • Die yield gap to target: -24.69 points
  • Passing die: 48,200 die
  • Total die tested: 52,000 die

Run it with your numbers

  • To rerun this with your own numbers, open the live Wafer Die Yield calculator, set target die yield to your actual value, and adjust the remaining inputs to match your operation.

Last reviewed 2026-05-12.